copper tungsten heat sink
Our YaSheng heat sink composites are engineered through wrought powder technology to deliver improved thermal conductivity and highly controlled thermal expansion.
Tungsten copper heat sinks is a term for a component or assembly that transfers heat generated within a solid material to a fluid medium, such as air or a liquid. Examples of heat sinks are the heat exchangers used in refrigeration and air conditioning systems and the radiator (also a heat exchanger) in a car. Heat sinks also help to cool electronic and optoelectronic devices, such as higher-power lasers and light emitting diodes (LEDs).
Our tungsten-copper composites are used in electronic packaging thermal management applications. These include:
Chip mounting
Heat sink material for naval, ground-based and aerospace radar
Circuit board cores
Lids or covers
Heat spreader
Semiconductors for the defense industry
Electric countermeasures
Jamming equipment
Microwave Packages
High RF Applications
Laser Mounts
Optoelectronics
Nickel-Gold plated external power amplifiers
5G mobile internet network
| Type | Composition | Properties | ||
| Tungsten Content | Density | CTE | Thermal Conductivity | |
| W90Cu | 90 ± 1 wt % | 17.0 g/cm3 | 6.5 ppm/K | 180 – 190 W/m.K |
| W85Cu | 85 ± 1 wt % | 16.3 g/cm3 | 7.0 ppm/K | 190 – 200 W/m.K |
| W80Cu | 80 ± 1 wt % | 15.6 g/cm3 | 8.3 ppm/K | 200 – 210 W/m.K |
| W75Cu | 75 ± 1 wt % | 14.9 g/cm3 | 9.0 ppm/K | 220 – 230 W/m.K |
| MIM (W-15Cu) |
Infiltrated W-15Cu Sheet |
MIM (Mo-18Cu) |
Infiltrated Mo-15Cu Sheet |
|
| Density(g/cm3) | 15.6-16.2 | 16.4 | 9.3-9.5 | 10.0 |
| Thermal Conductivity | 180-190 W/mK | 190 W/mK | 140-160 W/mK | 160 W/mK |
| Thermal Expansion Coefficient |
7.2 ppm/K | 7.47 ppm/K | 7.0 ppm/K | 7.0 ppm/K |
| Net-Shape Capability | Excellent | Sheets Only | Excellent | Sheets Only |
Molybdenum copper heat sinks is a composite made from Mo and Cu, Similar to W-Cu, CTE of Mo-Cu can also be tailored by adjusting the composition. But Mo-Cu is much lighter than W-Cu, so that it is more suitable for aeronautic and astronautic applications.
